The Role of 3D IC Chips in Advancing AI: Addressing the Thermal Management Challenge
As artificial intelligence (AI) continues to push the boundaries of computing power, the semiconductor industry faces an increasingly critical challenge: thermal management.
The Critical Role of Thermal Management in Advancing Microelectronic Components
The growing trend of integrating more devices onto a single chip has led to an unprecedented rise in power density. As a consequence, thermal issues have become a bottleneck in ensuring the optimal performance and longevity of microelectronic components.
Efficient Thermal Harmony: The Advantages of Ring-Shaped Heat Sinks for 3D IC Chips
The Advantages of Ring-Shaped Heat Sinks for 3D IC Chips